tiny small micro welding repair of circuit BGA traces and pads AQSTECH

Circuit Trace BGA Pad Micro Welding Services

AQSTECH offers micro circuit trace and BGA Pad welding services down to .02mm in size. BGA pad
damage can occure when improper solder reflow profiles are used in the removal process the of the Ball
Grid Array device. BGA Pad damage may also be a result of design failure of the the PCB. In both cases
we usually have the ability to repair the damaged traces / pads with our micro welding techniques.

Micro welding is far more superior than the "epoxy" backed BGA repair pads. Soldering the repair pad
traces to the damaged BGA pad trace is not strong enough to eliminate the possiblity of future seperation.
The ONLY solution to permanently resolve this reliability concern is to micro weld the trace junction
point. Thats where we come in.

AQS Computer Services in Clarence, NY known for Dell, Sony, HP & Compaq manufacture defect solutions
is your only source for innovative micro welding technology solutions.

Please contact us for further repair details (pricing and turn around time)