Micro Weld Fusion Is Stronger Than Conventional Solder

A weld fusion bond is far superior over conventional "solder" bonds especially when the need for maximum bonding strength is necessary.

Less Resistance - More Durable - Re-workable

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Micro Welding Service down to 0.2mm in size.....

Circuit Trace / Wire Welding Bond is Far Superior Over Solder!

Welded Pads / Wire / Circuits are rework-able unlike soldered items, also remains bonded at high solder melting temps!

Site Updated: 2-4-10
Micro Weld Applications

"Micro Fusion Welding" can be applied in any case or project where standard solder would normally be used.

The weld option is typically utilized in applications or areas where maximum bond strength is needed.


The Micro Weld can join or "fuse" together the following configurations:

Wire to Wire
Wire to Board
Trace to Trace
Trace to Board



With micro welding technology, we are able to weld wire and traces down to a size of 0.2mm Contact Us

 
Weld-able Metals

Micro Welding Technology allows for the ability to bond the following wire and trace material:

Aluminum
Copper
Tin Plated
Gold Plated
Stranded or Solid

Micro Weld Fusion Features

Rework-able! The same micro welded site / wire or trace is rework-able. This is a valuable feature when dealing with BGA (Ball Grid Array) applications.

Also, it's a valuable feature when a micro welded wire or tace is exposed to high heat temperatures (such as re-soldering) or extreme operating conditions. Contact Us
Communicate With Us

Contact:
contact@microfinewelding.com
Toll Free: 1-866-204-4677
Fax: 1-716-741-9203
Shipping Address:
AQSTECH
6745 Conner Rd
E.Amherst, NY 14051